Contact

One workflow. One metric. One conversation.

The most useful first message tells us the package family, the tools involved and the number you would like to move. We will tell you honestly whether we can move it.

Send an enquiry

Enquire

Start with the workflow

Tell us what is failing and on what. If Chipira is the wrong answer for it, we would rather say so on the first call than on the fourth.

Design partners
Pilot scoping, wedge selection, success metrics and preferential commercial terms.
Security reviews
Architecture and security pack for your IT/OT, IP and quality teams, under NDA.
Partnerships
Equipment OEMs, integrators and compute platforms.
Careers
Send the problem on this site you find most interesting.
Response time
One business day, from a person who has read what you wrote.
We start with one workflow and one measurable success metric.
We reply within one business day.

Who to reach

Four different conversations

Packaging and yield teams

Wedge workflow selection, shadow-mode protocol, baseline design and what a realistic pilot looks like on your line.

  • Tool inventory review
  • Metric and baseline design
  • Shadow-mode scoping

Quality, IT/OT and IP

Architecture, tenancy, audit, envelopes, fail-safe behaviour, deployment options and the compliance programme status.

  • Security pack under NDA
  • Fail-safe design review
  • On-premise and air-gapped options

Equipment vendors and integrators

Connector certification, co-sell motion, embedded autonomy and shared success metrics on joint accounts.

  • Interface scoping
  • Joint certification
  • Co-sell structure

Investors and analysts

Category thesis, market structure, moat mechanics and where we think we could be wrong.

  • Thesis and risks
  • Company stage evidence
  • Roadmap under NDA

Before the call

What makes the first meeting useful

None of this is required. All of it saves a week.

The package family
What you make, at what volume, and what a single unit is worth when it is scrapped at the last step.
The tools
Bonders, molding, X-ray, CT, SAM, AOI, handlers and testers — vendor and model where you can share it, and whether SECS-GEM is exposed.
The failure mode
The specific thing that is costing you: warpage, voids, alignment drift, known-good-die loss, ramp duration or escapes.
The constraint
What your IP, security and change-control posture will and will not permit. Knowing the ceiling early is more useful than discovering it later.
The owner
Who inside your organisation would own a pilot, and whether they have the mandate to sign a success metric.

What happens next

From enquiry to shadow mode

  1. Reply within one business day

    From someone technical, referencing what you actually wrote.

  2. Qualification call

    Forty-five minutes on the workflow, the tools and the constraint. We will tell you if it is not a fit.

  3. Technical session

    A working session with your process, quality and OT people on integration surface and fail-safe design.

  4. Pilot agreement

    One workflow, one signed success metric, one baseline method, one named owner on each side.

  5. Shadow mode

    Read-only connection and a measured baseline before anything is ever written to a tool.

Tell me on the first call what you cannot do. I will trust everything after that.

Packaging operations directorOSAT

Composite drawn from design-partner and industry conversations. Illustrative, not a customer endorsement.

Connector coverage across the back end

  • ASMPT
  • BESI
  • Kulicke & Soffa
  • EV Group
  • SUSS MicroTec
  • TOWA
  • Nordson
  • Camtek
  • Onto Innovation
  • Advantest
  • Teradyne
  • Cohu

Vendor-neutral integration over SECS-GEM, tool APIs and OT interfaces. Vendors listed are integration targets for the connector library and are not endorsements or commercial partnerships.

Practical

Before you write

  • Yes, and for most conversations we should. Send us your form or use ours; either is fine and neither takes long.

  • No. Exploratory conversations with packaging teams are how the product gets better, and we are not going to run a nurture sequence at you afterwards.

  • Selectively, where there is production-relevant work on packaging perception, warpage modelling or bonding control. Tell us what you are working on.

  • Yes, briefly. We will tell you plainly whether it is a fit, and if it is not, usually what a better fit would be.

Chipira

Every package, perfectly bonded.

One workflow, one measurable metric, one line. That is the whole ask.