The platform
One layer across a vendor-siloed back end.
Bonders from one vendor. Molding from another. X-ray, SAM and AOI from three more. Test from a sixth. Chipira is the layer that perceives across all of them, decides once, and acts on the process.
The shape of the thing
Not a dashboard. A system of action.
Most software sold into a packaging line is a viewer. It reads from the tools, renders a chart, raises an alarm, and leaves the decision — and the consequence — with a human who is already managing four other excursions.
Chipira is built the other way round. Perception exists to produce a decision; the decision exists to produce an action on the process; the action exists to produce a verified outcome that trains the next decision. Everything else is instrumentation for that loop.
That is why the platform is deployed at the fab edge rather than in a cloud console, why the connector layer writes as well as reads, why every move is checked in a twin before it executes, and why the audit trail is treated as a first-class product surface rather than a compliance afterthought.
Architecture
Three tiers, one contract
A cloud or private-VPC control plane governs models and fleets. A fab-edge tier runs vision, orchestration and action envelopes on site. The line tier is your existing tools, unchanged.
Capabilities
What the platform is made of
Perceive
Cross-modal packaging vision
Fine-tuned models for warpage and void in X-ray and CT, delamination in SAM, bump co-planarity, bridging and die cracks in AOI, and sub-micron alignment metrology — fused into one time-aligned view.
- X-ray / CT volumes
- Scanning acoustic microscopy
- AOI image streams
- Alignment and force telemetry
Decide
Agentic orchestration
Seven agents under a packaging-fab orchestrator, with idempotent steps, human-approval checkpoints and a model router that sends each step to the right model at the right cost.
- Event-driven agent runtime
- Graduated autonomy levels
- Model-agnostic routing
- Human-in-the-loop gates
Act
Closed-loop write-back
Setpoints, alignment corrections, stacking orders, routing and dispositions are written back to tools inside action envelopes your engineers define, with fail-safe stop and rollback.
- SECS-GEM write-back
- Bounded action envelopes
- Rollback on out-of-spec
- Robotic handling control
Simulate
Package-and-line twin
An Omniverse-based twin simulates bonding, stacking and molding, auto-optimising recipe and alignment to hit the target warpage, void and yield spec before the run.
- Thermo-mechanical priors
- Recipe auto-optimisation
- Pre-run spec validation
- Ramp DOE planning
Learn
The data flywheel
Every supervised correction, approval, write-back and test result becomes a time-aligned training artifact — linking perception to real process action and real yield outcome.
- Per-fab defect corpus
- Per-engineer craft memory
- Synthetic rare-defect library
- Tenant-isolated fine-tuning
Assure
Trust surface
Grounded, cited outputs; continuous evaluation gating every model and prompt change in CI; runtime guardrails; and an immutable, yield-grade audit log.
- Citation and grounding checks
- Golden-dataset evaluation
- Schema and safety guardrails
- Immutable audit trail
Non-functional
What it has to survive
A packaging line does not pause for your software.
- Reliability
- 99.9% uptime target, idempotent agent steps, graceful degradation, and fail-safe tool stop and robotic handling. If Chipira fails, the line falls back to its existing control — it does not stop.
- Performance
- High-throughput, low-latency inspection at the edge and real-time bonding and alignment control. Design target: sub-100 ms for inference decisions that affect routing or review [ASPIRATIONAL].
- Security
- SSO and RBAC, encryption in transit and at rest, per-tenant isolation, yield-grade audit logging, SOC 2 programme, strict process-IP protection and an on-premise option.
- Observability
- Full tracing, twin-based and golden-dataset evaluation gating in CI, and runtime guardrails on every agent action.
- Compliance
- Aligned to warpage, void and defect classification standards and package-reliability requirements where relevant to your qualification flow.
At the edge
A day in the log
The audit trail is not a report you export at quarter end. It is the running record of what every agent perceived, proposed, wrote and verified — and which engineer stood behind it.
chipira@fab-edge-04 ▸ chipira logs --agent all --tail
10:41:02 agent.place_and_bond setpoint.write force 18.4 N approved k.tanaka
10:41:02 twin.package_line validate warpage 61 µm within spec
10:41:07 agent.warpage_defect classify void · conf 0.994 escalated
10:41:09 agent.yield_ramp route rework auto
10:41:14 agent.stack_tsv sequence kgd 99.42% approved k.tanaka
10:41:21 agent.mold_underfill setpoint.write cure 142 °C approved auto
10:41:33 agent.place_and_bond rollback envelope breach held
7 actions · 2 escalations · 1 rollback · 0 unloggedIllustrative log output. Every line is immutable and attributable.
Yield engineerIDM back-end operationsWe do not need another alarm. We need something that already fixed it and can show me why.
Composite drawn from design-partner and industry conversations. Illustrative, not a customer endorsement.
Where we differ
Incumbents and copilots versus a system of action
Every incumbent owns a tool. Nobody owns the loop.
| Dimension | Incumbents & copilots | Chipira |
|---|---|---|
| Scope | A single task, locked to a single tool | The full place → bond → stack → mold → inspect → test → bin loop |
| Loop | Setpoints held, or measurement reported | Closed perceive–decide–act–verify at the fab edge |
| Data | Limited to one vendor’s own telemetry | Compounding cross-fab warpage, defect and yield corpus |
| Integration | Read-only, shallow, or single-vendor | Deep write-back across bonders, molding, inspection and test |
| Outcome | Assists a human | Performs the work; the human supervises exceptions |
Modules
Five products, one runtime
Land on inspection or alignment. Expand across the loop. They share one edge runtime, one connector layer and one dataset.
-
01
Bondix — Sub-micron bonding, run by an agent.
Acts on the bonder using Warpix perception and Twinix pre-checks, then feeds every bond outcome back to Yieldra.
-
02
Warpix — See every void before it costs a package.
The eyes of the loop — X-ray/CT, SAM and AOI perception feeding Bondix, Stackon and Yieldra from one shared defect corpus.
-
03
Stackon — HBM stacks that ramp, not scrap.
Sequences stack, TSV and underfill using known-good-die data from Warpix, validated in Twinix before a single die is placed.
-
04
Yieldra — The yield engineer’s craft, encoded.
The brain — fuses defect, tool and test data from every agent into yield and ramp actions, and retrains the fleet.
-
05
Twinix — Hit the spec before the line runs.
The simulator — every Bondix, Stackon and Yieldra move is checked in a package-and-line twin before it executes.
Trust
Autonomy is earned, not assumed
Chipira ships with the assumption that a packaging line is the most IP-sensitive and defect-sensitive environment in manufacturing. Every default is the conservative one.
- Grounded and cited outputs Retrieval over your recipes, package specs, design rules and classification standards — with citations, so every call is traceable to a source.
- Graduated autonomy Shadow → advisory → bounded autonomy, each gate opened only by measured accuracy and twin validation.
- Per-tenant isolation Data, vector stores, memory and fine-tuned models are scoped per tenant. No cross-tenant leakage, by construction.
- Immutable audit A yield-grade, tamper-evident record of every agent action, approval, override and rollback.
SOC 2 Type I is in progress and Type II is planned [ASPIRATIONAL].
Platform questions
Practical matters
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The gating item is almost never our software — it is tool access and change control on your side. A shadow-mode deployment on a single wedge workflow is scoped in weeks, not quarters, once SECS-GEM or API access to the target tools is granted.
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No. Chipira sits above your existing bonders, molding tools, inspection systems, test cells and MES. If we ever ask you to replace a tool to make our software work, we have built the wrong product.
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That is the normal case. Where SECS-GEM is available we use it; where it is not, we integrate over vendor APIs or OT interfaces, and where a tool is genuinely closed we run in perception-only mode and act on the neighbouring steps.
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Yes. The fab-edge tier is designed to keep operating through control-plane outages, and an air-gapped configuration is available where model updates are delivered as signed artifacts on your schedule.
Start narrow, expand relentlessly
Land one workflow. Own the loop.
A Chipira engagement begins with a single wedge workflow, a shadow-mode baseline and one signed success metric. Everything after that is expansion.